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| CYStech Electronics Corp. Small Signal Schottky (double) diodes Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 1/4 BAT54N3/BAT54AN3 BAT54CN3/BAT54SN3 Description Planar silicon Schottky barrier diodes encapsulated in a SOT-23 small plastic SMD package. Single diodes and double diodes with different pinning are available. Features *Very small conduction losses *Low forward voltage drop *Small plastic SMD package Applications *Ultra high-speed switching *Voltage clamping *Protection circuits *Blocking diodes Pinning Pin 1 2 3 BAT54 A NC K 3 1 2 1 Outline Description BAT54A BAT54C K1 A1 K2 A2 A1,A2 K1,K2 3 2 BAT54S A1 K2 K1,A1 SOT-23 3 1 2 N.C. (1) BAT54 3 1 2 1 (2)BAT54A 3 2 Marking: Type BAT54 N3 BAT54AN3 BAT54CN3 BAT54SN3 Marking Code L4 L42 L43 L44 (3)BAT54C (4)BAT54S Diode configuration and symbol BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification CYStech Electronics Corp. Absolute Maximum Ratings Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 2/4 * Maximum Temperatures Storage Temperature Tstg ................................................................................................... -65~+150 C Junction Temperature Tj .............................................................................................................. +125C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) Ptot (Note) ......................................................................... 230 mW * Maximum Voltages and Currents (Ta=25C) Repetitive Peak Reverse Voltage VRRM .............................................................................................. 30 V Continuous Forward Current IF ................................................................................................... 200 mA Repetitive Peak Forward Current(tp1s,duty cycle0.5)................................................ 300mA Non-repetitive Peak Forward Current (tp<10ms, sinusoidal) IFSM ............................................... 600 mA Note:for double diodes, Ptot is the total power dissipation of both diodes. Characteristics (Ta=25C) Characteristic Reverse Breakdown Voltage Symbol VBR VF(1) VF(2) Forward Voltage (Note 1) VF(3) VF(4) VF(5) Reverse Leakage Current (Note 2) Diode Capacitance Reverse Recovery Time Notes: 1.pulse test, tp=380s,duty cycle<2%. 2.pulse test, tp=5ms,duty cycle<2%. Condition IR=100A IF=0.1mA IF=1mA IF=10mA IF=30mA IF=100mA VR=25V,Tj=25 VR=1V, f=1MHz IF=IR=10mA RL=100 measured at IR=1mA Min. 30 - Max. 240 320 400 500 800 2 10 5 Unit V mV mV mV mV mV A pF ns IR CD trr BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current & Forward Voltage 250 Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 3/4 100 Diode Capacitance & Reverse-Biased Voltage 200 150 Diode Capacitance-Cd (pF) 0 200 400 600 800 1000 Forward Current-I F (mA) 10 100 50 0 1 Forward Voltage-VF (mV) 0.1 1 10 100 Reverse Biased Voltage-VR (V) BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Diagram: L 3 B 1 2 S Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 4/4 A Marking: L4_ L4X V G C D K 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3 J H * BAT54 N3: Single Diode (Marking Code L4) * BAT54AN3: Common Anode. (Marking Code L42) * BAT54CN3: Common Cathode. (Marking Code L43) * BAT54SN3: Series Connected. (Marking Code L44) *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.85 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification |
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